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Thermal structure design of high power LED flood light
Feb 22, 2018

Although high-power led flood light has many advantages such as energy saving and environmental protection, but at the same time because of its large power, resulting in a large number of heat due to the inability to disperse in time and easily caused by the decline of light source, the chip overheating and make the service life greatly shortened a series of problems, has been disturbed by high-power. The thermal management of high-power LED flood light mainly includes 3 aspects: chip level, package level and system integrated heat dissipation level. Wherein, the chip is the main heating part, its quantum efficiency determines the heat efficiency, the substrate material determines the efficiency of the chip to outbound, the package, packaging structure, materials and processes directly affect the thermal efficiency, the system integrated heat dissipation level is known as the external radiator, mainly including heat sinks, heat pipes, fans, temperature plate and so on. High-power LED lamp main cooling technology has heat sink, heat pipe, temperature plate, heat conduction double-sided adhesive, thermal silica film, thermal conductivity silicone grease.

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In cooling structure design of high power LED flood light, a good heat conduction channel should be to reduce the PCB, heat conduction medium, heat dissipation between the thermal resistance and increase the effective contact between the three, and select the appropriate heat conductivity of high heat conduction medium to accelerate the efficiency of heat conduction. High-power LED lamps heat source mainly from two parts: light source and power. Light source part of the heat, usually pay attention to the light source PCB and radiator body of the effective contact area between the surface, the more effective contact area, the better the heat dissipation. Also, be aware that the heat conduction interface between different mediums is as smooth as possible.      

 The heat conduction should be close enough to fit, and the contact surface of the embedded parts should be as small as possible.The natural convection heat transfer mode of high-power LED lamps and lanterns also requires effective heat dissipation area, therefore, under normal circumstances, the external wall of heat dissipation can increase the effective heat transfer area, in addition, in spraying different color paint to consider spraying thickness and the type of color paint thermal conductivity and heat radiation performance. Generally in order to increase the radiator heat transfer area, we use fin structure. The usual effective heat transfer area is 50%-60% of the overall area of the luminaire, and the fin-type radiator can determine the effective heat transfer performance according to the Fin efficiency and fin spacing.